Covor din cauciuc reciclabil SIKA

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Tip documentatie: Fisa tehnica
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urface defects such as blowholes and voids must be fully exposed. Repairs to the substrate, filling of blowholes/voids... Vezi tot
urface defects such as blowholes and voids must be fully exposed. Repairs to the substrate, filling of blowholes/voids and surface levelling must be ® ® ® carried out using appropriate products from the Sikafloor , SikaDur and SikaGard range of materials. High spots must be removed by e.g. grinding. All dust, loose and friable material must be completely removed from all surfaces before application of the product, preferably by brush and/or vacuum. Application Conditions / Limitations Substrate Temperature +10°C min. / +30°C max. Ambient Temperature +10°C min. / +30°C max. Substrate Moisture Content < 3% pbw moisture content. Test method: Sika®-Tramex meter, CM - measurement or Oven-dry-method. No rising moisture according to ASTM (Polyethylene-sheet). Relative Air Humidity 80% r.h. max. Dew Point Beware of condensation! The substrate and uncured floor must be at least 3°C above dew point to reduce the risk of condensation or blooming on the floor finish. Applicatio ... ascunde
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